London, UK and Seoul, Korea – 18th June 2019 – Imagination Technologies’ PowerVR Series9XTP has been selected by Telechips, a global fabless semiconductor company for connectivity and multimedia in automotive and smart homes, for use in its in-vehicle infotainment (IVI) and vehicle cockpit solutions.
Leanne Lee, Future Strategy Group Leader, Telechips, says, “We selected Imagination’s PowerVR Series9XTP GPUs for two reasons – PowerVR’s extensive history and experience in the automotive industry and its GPU virtualization capabilities. We needed a vendor that understood the unique challenges faced by the automotive market, and that offered a cost-efficient, flexible and futureproof solution, with the robustness needed for the target market. We found all of that in PowerVR and we look forward to collaborating with them on other automotive-focused projects in the future.”
The hardware virtualization capabilities of the PowerVR architecture is capable of hosting multiple operating systems (OS) using a single GPU core with no impact on performance. Imagination’s virtualization solution offers guaranteed quality of service and reliability to all applications running on the GPU and robustness to ensure the required level of security mandated by the automotive industry.
The PowerVR architecture also offers the additional benefit of an extensive tool suite for debugging and tuning, and a wide range of automotive ecosystem partnerships built up from working in this industry for over 10 years.
Nigel Leeder, Executive Vice President, PowerVR, Imagination, says, “GPU virtualization is a must-have for automotive. GPUs that implement hardware virtualization can provide isolation between the various applications/OSs for increased security, as well as maximum utilisation of the underlying GPU hardware. We’re delighted to be working with Telechips on its next-generation SoCs and look forward to further future collaborations.”
PowerVR Series9XTP, based on the Furian architecture, is Imagination’s most recently announced GPU family. Thanks to extensive power/performance/area (PPA) optimisations its high-performance density makes it an ideal solution for the automotive market.
Key improvements over the previous generation include:
- Up to 50% fps/mm2 density increase
- Extensive PPA optimisation throughout the design, including low-level architectural tuning
- ALU-width up to 40-wide per cluster for a significant increase in FLOP density
- Reduced bandwidth usage through PVRIC4 and micro-architectural cache tuning
- YUV sampling and filtering speed-up
